Kyocera AVX showcases RF and microwave technologies at IMS 2026
Kyocera AVX is exhibiting its portfolio of RF and microwave components at IMS 2026 in Boston from June 7 to June 12. The showcase features solutions designed to address SWaP-C, performance, and reliability challenges in 5G, 6G, IoT, aerospace, and defense sectors. A seminar on thin-film sputtering technologies is also scheduled for June 11.

*this image is generated using AI for illustrative purposes only.
Kyocera AVX is showcasing its extensive selection of advanced RF and microwave components at IMS 2026 in Boston this week. The exhibition, running from Sunday, June 7, through Friday, June 12, features technologies engineered to solve complex Size, Weight, Power, and Cost (SWaP-C), performance, and reliability challenges in 5G, 6G, IoT, aerospace, defense, radar, and satcom applications.
As part of the IEEE MTT-S RF Technology & Techniques (RFTT) Symposium on Thursday, June 11, Kyocera AVX Principle Research Engineer Jonathan Herr will present a seminar titled "Using Thin-Film Sputtering Technologies to Create new Bias Options." The presentation aims to help microwave design engineers overcome physical board constraints without sacrificing signal integrity or DC bias efficiency.
The company's exhibit at Booth #16075 includes a variety of components such as capacitors, couplers, filters, antennas, inductors, and resistive products. These products are designed for high-frequency, ultra-low-loss, and high-density performance in telecommunications applications, as well as stable, high-reliability performance in mission-critical sectors.
Key exhibit highlights include the newly expanded range of 550/560 Series ultra-broadband capacitors, DB0402 3dB 90° hybrid couplers, and BP1206 and BP2816 Series Thin-Film Band-Pass Filters. The display also features antennas optimized for automotive and industrial IoT, including A-Series embedded automotive broadband antennas and 2.4GHz automotive corner chip antennas.
IMS 2026 is expected to host over 8,400 attendees from 55 countries, representing the full scope of the wireless technology supply chain. The event combines four distinct symposia, including the IEEE MTT-S RF Integrated Circuits (RFIC) Symposium and the ARFTG Microwave Measurement Conference.
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How might the thin-film sputtering technologies presented by Kyocera AVX influence future PCB design standards for 6G applications?
What impact will the expanded ultra-broadband capacitor range have on the cost and efficiency of next-generation aerospace radar systems?
How are the new automotive antennas positioned to compete in the evolving vehicle-to-everything (V2X) communication market?


































