onsemi targets $213 billion market with power density strategy

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Reviewed by
Shriram SScanX News Team
Key Highlights
  • onsemi targets a $213 billion total addressable market by 2030
  • Strategy focuses on solving power density constraints in AI and electrification
  • Company leverages high-voltage, Treo, and Embedded Power Platform technologies
  • Growth expected from converging automotive, industrial, and data center markets
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*this image is generated using AI for illustrative purposes only.

onsemi (NASDAQ: ON) outlined a long-term growth strategy on Sept. 16, 2026, targeting a $213 billion total addressable market by 2030. The semiconductor firm aims to solve power density constraints limiting advancements in artificial intelligence, electrification, and automation.

CEO Hassane El-Khoury stated that power density has emerged as a defining engineering challenge of the decade. He noted that companies delivering more energy while consuming less space will lead the next era of innovation.

Market Convergence

The company identifies a convergence across automotive, industrial, AI data center, and emerging applications. These markets increasingly rely on common capabilities: efficient power conversion, physical perception, precision actuation, and connectivity.

Market Segment Key Requirement
Automotive Electrification
Industrial Energy systems
AI Data Centers Power infrastructure
Emerging Autonomous applications

This convergence allows onsemi to deploy common technology platforms across multiple end markets. High-voltage technology developed for automotive electrification can support industrial energy systems and AI data centers.

Technology Platforms

onsemi highlighted three technology platforms driving long-term growth:

  • High-Voltage Technologies: Spans silicon, silicon carbide (SiC), and gallium nitride (GaN). Includes vertical gallium nitride (vGaN), exclusive to onsemi, for next-generation high-voltage applications.
  • Treo: Provides high precision analog, high density digital, and high voltage capabilities for adaptive and autonomous systems.
  • Embedded Power Platform (EPP): Uses the silicon wafer as the package to integrate silicon, SiC, and GaN technologies within a wafer-level architecture.

El-Khoury emphasized that power has become the common denominator across end markets. This creates opportunities to innovate beyond individual market trends.

Physical AI Focus

The company anticipates the next phase of AI growth will occur at the edge, where intelligence moves into machines interacting with the physical world. These systems require four capabilities: power, sense, control, and connected compute.

onsemi plans to apply technologies developed for automotive and industrial applications to this emerging market. The focus on system-level co-design aims to capture a larger share of value created by physical AI.

What the Numbers Show

The disclosed $213 billion addressable market represents a significant expansion from traditional component sales. By targeting system architectures rather than individual components, onsemi seeks to increase revenue potential per customer. This shift implies higher leverage from R&D investments and reduced dependence on single end markets.

Disclaimer: This article is AI-generated using data from ViewTrade. ScanX is not liable for any inaccuracies.

How might onsemi's exclusive vertical gallium nitride (vGaN) technology impact competitive dynamics against rivals like Infineon or STMicroelectronics in the high-voltage power market?

What are the potential supply chain risks associated with onsemi's strategy to integrate silicon, SiC, and GaN technologies within a single wafer-level architecture?

How could the shift toward 'Physical AI' at the edge alter onsemi's revenue mix between traditional automotive/industrial segments and emerging autonomous applications by 2030?

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Subaru evaluates onsemi's Embedded Power Platform for future EVs

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Reviewed by
Ritika DScanX News Team
Key Highlights
  • onsemi and Subaru enter strategic technology engagement to evaluate Embedded Power Platform for future EVs
  • EPP architecture increases power density by 3 – 5x compared with current solutions
  • Platform enables up to 4x higher power density and 15% lower power losses for electric vehicles
  • Subaru will access engineering samples and simulation models for early evaluation
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*this image is generated using AI for illustrative purposes only.

onsemi (NASDAQ: ON) announced a strategic technology engagement with Subaru Corporation to evaluate its Embedded Power Platform (EPP) for future electrified vehicles. The collaboration aims to assess how advanced power integration can improve efficiency and simplify development.

Scottsdale-based onsemi unveiled the EPP architecture on Sept. 16, 2026. The platform uses the silicon wafer as the package foundation, integrating electrical, mechanical and thermal performance. This design increases power density by 3 – 5x compared with current solutions.

Architecture and Integration

EPP treats the silicon wafer as an active contributor to system performance rather than passive housing. It enables seamless integration of silicon, silicon carbide (SiC) and gallium nitride (GaN) technologies. Multiple devices, including FETs, drivers and controllers, are embedded in one package.

The platform leverages standard 12-inch silicon wafer manufacturing capabilities. Early sampling is expected in 2026 with strategic customers.

Application Benefits

The company highlights specific improvements for key sectors:

Sector Key Benefit Metric
AI Infrastructure Solid-state circuit-breaker size ~50% smaller
AI Infrastructure Thermal performance 20% cooler
Electric Vehicles Power density Up to 4x higher
Electric Vehicles Power losses 15% lower

In AI racks, EPP reduces packaging overhead to support more compact power systems. For electric vehicles, it enables smaller traction inverters with improved efficiency.

Strategic Partnership

Subaru will evaluate the platform for future electrified vehicle architectures. The collaboration includes access to engineering samples and simulation models. Tamotsu Inui, Managing Executive Officer Chief General Manager of Engineering Div at Subaru, stated that the engagement allows evaluation of EPP’s integrated approach while drawing on onsemi’s modeling expertise.

Dinesh Ramanathan, Senior Vice President of Corporate Strategy at onsemi, noted that the transition to electrification is driving sophisticated vehicle architectures. He added that Subaru’s engagement brings valuable customer insight to EPP’s continued evolution.

What the Numbers Show

The source data reveals a significant divergence in performance metrics between AI and automotive applications. While AI infrastructure gains focus on physical footprint reduction (50% smaller) and thermal management (20% cooler), electric vehicle applications prioritize efficiency gains (15% lower losses) and density (4x higher). This suggests distinct optimization priorities for each end-market despite using the same underlying architecture.

Disclaimer: This article is AI-generated using data from ViewTrade. ScanX is not liable for any inaccuracies.

How might onsemi's Embedded Power Platform disrupt the current competitive landscape among automotive semiconductor suppliers like Infineon and STMicroelectronics?

What are the potential supply chain implications for onsemi as it scales 12-inch wafer manufacturing to meet demand for both AI infrastructure and EV markets?

Could the distinct optimization priorities for AI (size/thermal) versus EVs (efficiency/density) lead to fragmented product lines, or will a unified architecture suffice?

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