UMC stock rises on silicon photonics mass-production milestone
United Microelectronics Corp (UMC) and SILITH Technology announced the first mass-production wafer delivery of photonic ICs from UMC’s Singapore fab, advancing their partnership for AI data center optical interconnects. The platform, developed in 18 months, has been qualified by a leading cloud infrastructure customer. The companies are extending the roadmap to 400G/lane products, with UMC planning to open its platform for customer development in 2027.
*this image is generated using AI for illustrative purposes only.
United Microelectronics Corp (UMC) shares rose in Tuesday’s premarket trading after the company achieved a mass-production milestone with Singapore-based SILITH Technology. The gain came as S&P 500 futures slipped 0.1%, pointing to a company-specific reaction to the news. UMC and SILITH delivered the first mass-produced silicon photonics wafers from UMC’s 12-inch Singapore fab, moving SILITH’s 1.6T platform into high-volume production for AI data center optical interconnects.
The joint team brought the silicon photonics platform from development to production readiness in 18 months. It combines SILITH's proprietary architecture with UMC's advanced process integration and silicon-on-insulator (SOI) manufacturing capabilities. The platform has demonstrated production-level performance with high yield and reliability and has been qualified by a leading cloud infrastructure customer for volume deployment.
Strategic Collaboration and Technology
The partnership leverages SILITH's innovation and UMC's high-volume 12-inch manufacturing platform. UMC’s silicon photonics process integration is designed as a scalable, foundry-ready platform. It aims to deliver predictable cost, yield, and ramp timelines for customers building next-generation AI data center optical interconnects.
Product Roadmap and Future Developments
Building on the commercialization of SILITH's 200G/lane silicon photonics products, the companies are extending the roadmap to support next-generation 400G/lane optical interconnects. They are collaborating on a 400G/lane pure-silicon photonics platform, leveraging high-speed silicon Mach-Zehnder Modulators (MZMs) to enable transmission while preserving manufacturability and scalability.
| Metric | Detail |
|---|---|
| Development Timeline | 18 months |
| Current Platform | 1.6T silicon photonics |
| Product Speeds | 100G/lane, 200G/lane, 400G/lane |
| Cumulative Shipments | > 8 million PICs |
UMC is making its own 12-inch silicon photonics platform available for customer product development in 2027. Additionally, UMC is collaborating with ecosystem partners to develop thin-film lithium niobate (TFLN)-based solutions for future ultra-high-bandwidth optical interconnects. These platforms, combined with UMC's advanced packaging technologies, will enable optical-engine modules supporting co-packaged optics (CPO) and optical I/O architectures.
Executive Commentary
Jason Zhang, Chief Technology Officer of SILITH, stated that AI is driving unprecedented demand for optical bandwidth, making silicon photonics a foundational technology for future data center infrastructure. He emphasized that SILITH is building a scalable platform spanning pluggable optics, CPO, and future optical I/O architectures.
GC Hung, Senior Vice President of UMC, highlighted that the milestone reflects UMC’s ability to support customers at scale with deep integration expertise required for complex technologies like silicon photonics. He noted that Singapore serves as a key technology development hub for UMC, enabling the rapid production ramp with SILITH.
How will the transition to the 400G/lane pure-silicon photonics platform impact UMC's competitive positioning against other foundries in the AI optical interconnect market?
What is the expected revenue contribution from the 1.6T platform mass production, and will it significantly alter UMC's financial outlook for the current fiscal year?
How might the availability of UMC's 12-inch silicon photonics platform for general customer development in 2027 affect the broader foundry landscape and customer partnerships?


























