QTREX Quantum manufactures cryogenic chip carrier through its AME process
QTREX Quantum Ltd. produced a cryogenic chip carrier using its proprietary single-build AME process, designed by a major U.S. technology company. This expands QTREX's role into the processor-interface layer, addressing signal transport and carrier-level functions. The company plans to present samples at Quantum.Tech World 2026 in Boston.

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QTREX Quantum Ltd. (Nasdaq: QTEX) has successfully produced a cryogenic chip carrier using its proprietary single-build Additively Manufactured Electronics (AME) process. The development, based on a design supplied by one of the world's largest U.S.-based technology companies developing full-stack quantum computing systems, marks a significant expansion of QTREX's role within the quantum hardware stack into the processor-interface layer. This advancement demonstrates that the company's AME platform can address both signal transport and critical carrier-level functions around the quantum processor.
The cryogenic chip carrier supports the quantum processor and manages signal fan-out between the processor interface and the cryogenic I/O stack. As quantum systems scale, this interface becomes increasingly important, requiring denser routing, stronger shielding, lower thermal load, controlled signal integrity, and repeatable manufacturing. QTREX's carrier uses a Kapton-class polyimide architecture adapted for very low-temperature environments.
By integrating the cryogenic chip carrier and interconnect structure into one monolithic architecture, the single-build AME process enables conductive pathways, dielectric structures, shielding features, and direct interconnect transitions to be produced together. This approach reduces connectorized transitions, which lowers potential failure points, simplifies the signal path, and supports substantially higher routing density. The architecture allows shielding to be engineered directly into the carrier and utilizes 3D routing geometries.
"Following engagement with multiple quantum computing companies and the evaluation of this capability with one of the industry's leading players, we view this milestone as representing a meaningful expansion of our position within the quantum hardware ecosystem," said Dagi Ben-Noon, CEO of QTREX. "By enabling the cryogenic chip carrier and interconnect structure to be produced within the same single-build AME architecture, we are expanding our quantum connectivity platform to include processor-interface functions."
The next phase is expected to focus on customer-specific cryogenic chip carrier designs tailored to each processor architecture, chip design, and system-level requirement. QTREX plans to present the chip carrier sample during private meetings in Boston around Quantum.Tech World 2026, taking place on June 25–26, 2026.
How will the transition to customer-specific designs impact QTREX's production timelines and unit economics?
What are the potential revenue implications from expanding into the processor-interface layer for the quantum hardware stack?
How might this single-build AME process influence the standardization of interconnect architectures across the quantum computing industry?


























