Mold-Tek Packaging Limited has made the audio recording of its first-quarter FY27 earnings conference call publicly available. The call, held on July 27, 2026, at 4:30 PM IST, featured J Lakshmana Rao, Chairman and Managing Director, discussing the company’s financial and operational performance for the quarter. Investors can now access the recording directly via the company’s official website to review management’s commentary and responses to analyst queries.

The disclosure was made pursuant to Regulation 30 of the Securities and Exchange Board of India (Listing Obligations and Disclosure Requirements) Regulations, 2015. In a filing dated July 27, 2026, submitted to both the Bombay Stock Exchange (BSE) and the National Stock Exchange of India Limited (NSE), the company confirmed that the audio file has been uploaded to its corporate website. This follows the earlier announcement of the call schedule on July 22, 2026.

Accessing the Recording

The audio recording is hosted on Mold-Tek Packaging’s website under the investor relations section. The direct link provided in the exchange filing allows immediate access to the full session. This step completes the regulatory requirement for post-call transparency, enabling shareholders who could not attend live to review the discussion.

Key Details

The conference call was organized by Emkay Global Financial Services Ltd., which facilitated dial-in access for domestic and international participants. While the live event has concluded, the archived recording serves as a permanent reference for stakeholders analyzing the company’s quarterly outlook.

Regulatory Compliance

Mold-Tek Packaging Limited adhered to SEBI’s listing obligations by promptly uploading the recording after the call’s conclusion. The filing was signed by J Lakshmana Rao, whose digital signature confirms the authenticity of the submission. Harshita Suresh Chandnani, Company Secretary and Compliance Officer, previously confirmed the call schedule in compliance with the same regulations.

This update ensures that all investors have equal access to the information presented during the earnings discussion, maintaining market integrity and transparency as mandated by Indian securities laws.

Mold-Tek Packaging Limited will hold a virtual meeting with analysts and institutional investors on June 18, 2026. The interaction is scheduled to begin at 2:15 PM IST and will be conducted via virtual mode. This engagement is part of the company's ongoing investor relations activities under the SEBI (Listing Obligations and Disclosure Requirements) Regulations, 2015.

The primary participant for the meeting is Ashika Stock Services Limited. The session is categorized as a 1x1 or group meeting, allowing for direct interaction between company officials and the representatives of the broking house. The company stated that officials would refer to publicly available documents during these discussions.

Crucially, Mold-Tek Packaging clarified that no unpublished price sensitive information (UPS) is intended to be shared during the interaction. This ensures compliance with regulatory standards regarding fair disclosure and prevents the selective dissemination of material information that could influence stock prices.

The schedule for the meeting remains subject to change due to exigencies on the part of either the participant or the company. The intimation was formally submitted to the stock exchanges by Harshita Suresh Chandnani, Company Secretary and Compliance Officer.

Meeting Details