Mold-Tek Packaging Investor Call Scheduled for Q4FY26 Results on May 11, 2026

Mold-Tek Packaging Limited has announced an investor conference call scheduled for Monday, May 11, 2026, at 4:30 PM IST. The call is being held pursuant to Regulation 30 of the SEBI (Listing Obligations and Disclosure Requirements) Regulations, 2015, to discuss the company's financial results for the quarter and year ended March 31, 2026. The event will feature J Lakshmana Rao, Chairman and Managing Director of the company, and is hosted by Emkay Global Financial Services Ltd.

Conference Call Details

The official intimation, dated May 06, 2026, was filed by Harshita Suresh Chandnani, Company Secretary and Compliance Officer. The filing reference number is MTPL/SECT/05/2026-27. The invitation was addressed to both BSE Limited and the National Stock Exchange of India Limited.

Parameter	Details
Date	Monday, May 11, 2026
Time	4:30 PM (IST)
Speaker	J Lakshmana Rao – Chairman and Managing Director
Host	Emkay Global Financial Services Ltd
Filing Reference	MTPL/SECT/05/2026-27

Access and Contact Information

Participants can join the conference call using universal access numbers or international toll-free lines. Pre-registration is available to enable express joining via DiamondPass™ to avoid wait times.

Access Type	Contact Details
Universal Access	+91 22 6280 1325 / +91 22 7115 8226
Contact Person	Rajesh Kumar, Emkay Global
Contact Email	rajesh.kumar@emkayglobal.com

International toll-free dial-in numbers are available for various regions including the USA (18667462133), UK (08081011573), Singapore (8001012045), Australia (0080014243444), and Japan (00531161110), among others.

Trading Window Closure

In accordance with insider trading regulations, the trading window for the company was closed effective April 01, 2026. The window will remain shut until 48 hours after the declaration of the audited financial results. Consequently, the trading window is scheduled to reopen after May 13, 2026.

1 Day	5 Days	1 Month	6 Months	1 Year	5 Years
-1.21%	+3.73%	+6.32%	-15.34%	+15.07%	+30.23%

Mold-Tek Packaging Limited has announced that its Board of Directors has approved the first interim dividend of ₹2 per equity share, representing 40% on the face value of ₹5 each for the Financial Year 2025-26. The decision was taken during the board meeting held on April 20, 2026, which commenced at 11:00 A.M. (IST) and concluded at 11:35 A.M. (IST).

Dividend Details

The company has finalized the key parameters for the interim dividend distribution:

Parameter:	Details
Dividend Amount:	₹2 per equity share (40%)
Face Value:	₹5 per share
Financial Year:	2025-26
Record Date:	Friday, April 24, 2026
Payment Timeline:	Within stipulated timelines as prescribed under law

Record Date and Eligibility

The record date for determining shareholder eligibility for the interim dividend payment has been fixed as Friday, April 24, 2026. This date will serve as the cut-off for identifying members entitled to receive the dividend. The interim dividend shall be duly paid within the stipulated timelines as prescribed under law.

Stock Exchange Notifications

Mold-Tek Packaging Limited has formally notified both major stock exchanges about the board meeting outcome. The communication was addressed to BSE Limited and the National Stock Exchange of India Limited, ensuring full compliance with disclosure requirements. The notification was digitally signed by Harshita Suresh Chandnani, Company Secretary and Compliance Officer, on April 20, 2026, with reference number MTPL/SECT/03/2026-27.

Board Meeting Timeline

The board meeting was conducted efficiently, commencing at 11:00 A.M. (IST) and concluding at 11:35 A.M. (IST) on April 20, 2026. The meeting focused on considering and approving the interim dividend proposal, which was successfully passed by the directors.