Foxconn advances AI factories, infrastructure at VivaTech

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Reviewed by
Suketu GScanX News Team
Key Highlights

Hon Hai Technology Group (Foxconn) advanced its AI leadership at VivaTech, showcasing end-to-end AI integration, rack-scale supercomputing, and partnerships with Bull and NVIDIA to build the NVIDIA Vera Rubin NVL72 platform in Europe. The company also displayed two EVs and humanoid robotics, highlighting its Build-Operate-Localize model and capabilities in AI factories, EV platforms, and precision assembly.

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*this image is generated using AI for illustrative purposes only.

Hon Hai Technology Group (Foxconn) accelerated its global leadership in AI factories and sovereign AI infrastructure by showcasing its end-to-end integration capabilities at VivaTech in Paris on June 17, 2026. The company highlighted its role as the world's largest AI server provider, demonstrating the world's most state-of-the-art rack-scale AI supercomputer. The showcase underscores Foxconn's commitment to strengthening its Build-Operate-Localize presence in Europe through technology collaboration with industry, startups, government, and academia.

Strategic Partnerships and AI Infrastructure

Foxconn, in partnership with Bull of France and NVIDIA, announced a strategic milestone to build the NVIDIA Vera Rubin NVL72 platform in Europe, which will be commercialized under the Bull brand. The collaboration aims to leverage Bull's leadership in advanced computing and AI. At Foxconn Booth 2B41, the NVIDIA Vera Rubin NVL72 was presented as the next frontier of Agentic AI, alongside the NVIDIA HGX Rubin NVL8 and NVIDIA MGX 4U system. These displays affirm Foxconn's manufacturing strengths in high-density AI racks, compute trays, liquid cooling, power delivery, and system integration.

End-to-End AI Solutions

Foxconn's dedicated business unit for AI supercomputing and cloud operations, Visionbay.ai, demonstrated end-to-end solutions covering full-stack AI factory operations, technical services, and application ecosystems. Visionbay.ai is an NVIDIA Cloud Partner (NCP). The solutions showcased at VivaTech highlight Foxconn's ability to integrate advanced AI technologies into scalable operations, supporting diverse industries across Europe.

Electric Vehicles and Robotics

For the first time in Europe, Foxconn displayed two modern electric vehicles (EVs) under its FOXTRON Vehicle Technologies unit, offered via a Contract Design and Manufacturing Service (CDMS) model. The vehicles included the MODEL B sporty crossover, sold in Taiwan under the BRIA brand, and the MODEL D lifestyle multipurpose utility vehicle. These exhibits showcased Foxconn's capabilities in EV platforms, complete vehicle design, smart cockpits, and advanced electronic/electrical (E/E) architectures.

Additionally, a wheeled humanoid robot demonstrated dual-arm collaboration for precision assembly tasks. The robot's embodied intelligence is derived from actual factory scenarios, combining simulation-based training with on-site iteration to enable rapid deployment and scalable rollout across manufacturing facilities.

Key Technologies Showcased

Technology Description
NVIDIA Vera Rubin NVL72 Next frontier of Agentic AI, built in Europe under Bull brand
NVIDIA HGX Rubin NVL8 High-density AI rack solution
NVIDIA MGX 4U system Advanced system integration and power delivery
MODEL B EV Sporty crossover, sold in Taiwan under BRIA brand
MODEL D EV Lifestyle multipurpose utility vehicle

Foxconn's presence at VivaTech marks its European debut at a major startup and tech event, reinforcing its global leadership in AI infrastructure and diversified business models.

How will the localization of the NVIDIA Vera Rubin NVL72 platform under the Bull brand impact the competitive landscape for AI infrastructure within Europe?

What is the projected timeline for the commercial rollout of Foxconn's EV manufacturing services to European automotive clients following this debut?

To what extent can the embodied intelligence demonstrated by the humanoid robot be scaled to other manufacturing sectors outside of electronics assembly?

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