TTM Technologies, Inc. will exhibit at the 2026 Farnborough International Airshow, scheduled for July 20–24, to showcase its advanced electronics and interconnect solutions for aerospace and defense markets. The company plans to establish a more direct European presence through the pending acquisitions of Swiss Technology Group AG and ILFA GmbH, subject to regulatory approval. TTM's participation underscores its commitment to providing secure, reliable electronics for European defense programs amid growing budgets and accelerated procurement of next-generation capabilities.

At the event, TTM will highlight its extensive defense program backlog, which spans radar, missile defense, electronic warfare, and combat-proven mission systems. The company is America's largest domestic manufacturer of advanced printed circuit boards (PCBs) and mission-critical electronics, trusted by the U.S. military and leading defense prime contractors. TTM's portfolio includes technology on more than 480 programs and over 30 munitions, with electronics embedded in airborne surveillance radar, integrated air and missile defense platforms, and missile guidance systems.

Strategic Expansion in Europe

TTM's U.S. manufacturing facilities are cleared, certified, and purpose-built for demanding defense applications. Combined with ITAR-compliant operations and an expanding European footprint, the company positions itself as a trusted partner for European customers. The acquisitions of Swiss Technology Group AG and ILFA GmbH aim to enhance its manufacturing depth, global supply chain reach, and program expertise for allied partners.

Capabilities and Offerings

TTM's offerings at Farnborough will include:

"TTM has spent decades earning the trust of the U.S. defense community — on the programs that matter most and the platforms that cannot afford failure," said Cathie Gridley, Executive Vice President and President, Aerospace and Defense, TTM Technologies. "We come to Farnborough to bring that proven capability to our European allies and partners."

Gridley added, "Europe's defense modernization is accelerating — and it deserves a manufacturing partner that can match that ambition. Our presence at Farnborough reflects our commitment to building long-term technology partnerships." TTM Technologies will be located at Chalet 409 during the trade days, with senior representatives available for meetings.

TTM Technologies, Inc. celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board (PCB) manufacturing facility in Syracuse, New York. The $130 million investment strengthens the U.S. defense electronics industrial base by establishing domestic production capacity for advanced microelectronics. This expansion directly supports next-generation radar, missile defense, space, and autonomous systems programs.

The new facility spans 215,000 square feet on TTM's existing Syracuse campus. It is among the first in the nation purpose-built for Ultra-HDI PCB and advanced packaging production. The project will create up to 400 new engineering and manufacturing jobs, increasing TTM's total Central New York workforce to approximately 1,000 employees.

"This is more than a facility — it is a statement about where American defense manufacturing is headed," said Cathie Gridley, EVP and President of Aerospace & Defense at TTM Technologies. She emphasized that the investment strengthens the U.S. microelectronics supply chain and positions TTM to support next-generation defense and national security technologies for decades.

Strategic Investment and Funding

The total investment of $130 million includes a $30 million contribution from the U.S. Department of War. This funding recognizes the facility's strategic importance to national security and aligns with the domestic microelectronics revival. The project addresses a critical gap in the U.S. defense industrial base, where domestic production capacity for these advanced board technologies has been severely limited.

Operational Capabilities

Ultra-HDI PCBs enable unprecedented miniaturization and performance density in advanced electronics. The Syracuse facility will produce these essential components for aerospace and defense programs. Until now, the majority of global manufacturing for these technologies has been concentrated in Asia.

The facility builds on TTM's more than 60-year manufacturing presence in Syracuse. First announced in November 2023, the project was marked by a beam-signing ceremony attended by Governor Kathy Hochul in October 2024.