TTM Technologies, Inc. announced on June 17, 2026, its intent to acquire two European companies, Swiss Technology Group AG (STG) and ILFA GmbH, in separate all-cash transactions. These acquisitions aim to establish TTM's initial footprint in the European market and add long-cycle businesses with strategic technology capabilities to its portfolio. The transactions are subject to regulatory approvals and are expected to close in the third quarter of 2026.

Strategic Rationale and Financial Impact

The acquisitions align with TTM's updated long-term strategy to diversify through product and geographic expansion. Edwin Roks, President and Chief Executive Officer of TTM Technologies, stated that these moves reinforce the company's "up the chain" value-add technology approach. The combined acquisitions are expected to be immediately, albeit modestly, accretive upon completion, excluding purchase accounting adjustments and similar factors.

Overview of Acquired Entities

Swiss Technology Group AG, headquartered in Zurich, Switzerland, was created through the merger of GS Swiss and the Hofstetter Group in 2023. STG focuses on miniaturized and small form-factor technology applications, primarily for the Medical end market, with relevant technology for Aerospace & Defense. It produces rigid, rigid-flex, and flex printed circuit board (PCB) solutions and operates facilities in Switzerland and Germany.

ILFA GmbH, headquartered in Hannover, Germany, has a 45-year legacy in providing complex PCB solutions for Aerospace & Defense, Industrial, and Medical technology markets. ILFA adds CAD services for prototyping and production and holds certifications for electro-optical PCBs, component embedding, and fluid channel integration.

Transaction Details

TTM expects to provide additional insights for investors during its formal second quarter earnings call projected for early August.

TTM Technologies, Inc. announced that its Mini-Xinger RF product portfolio has achieved AEC-Q200 qualification accreditation, a milestone validating the product line's conformance to the highest standards of passive component reliability for automotive and high-reliability applications. The qualification, established by the Automotive Electronics Council (AEC), serves as the industry benchmark for stress testing and reliability qualification of passive electronic components. Earning this accreditation confirms that TTM's Mini-Xinger RF product portfolio meets or exceeds rigorous requirements across temperature cycling, mechanical shock, vibration, humidity, and electrical performance, ensuring consistent, long-term reliability in demanding operating environments.

The AEC-Q200 qualification provides confidence to TTM's automotive and emerging commercial space customers that Xinger brand components meet the stringent qualification standards of their critical markets. Long recognized as the preferred passive RF solution for satellite-based navigation technologies, GPS/GNSS and telecom integrations on automotive platforms, Xinger components are trusted for their reliability, performance, and compact form factors. This proven performance is now gaining distinction in commercial space applications, where thermal stability and thermal reliability are critical in the harsh environmental conditions of space.

Mini-Xinger RF Product Portfolio

The Mini-Xinger is a signature product line of TTM's RF & Specialty Components (RF&S) business unit. It offers a broad range of high-performance directional couplers, hybrid couplers, and power dividers trusted across commercial wireless infrastructure, aerospace, defense, and automotive applications.

TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency (RF) components, RF microwave/microelectronic assemblies, and technologically advanced interconnect products, including PCBs and substrates.