TTM Technologies opens Ultra-HDI facility in Syracuse
TTM Technologies celebrated the grand opening of its $130 million Ultra-HDI PCB facility in Syracuse, New York, creating 400 jobs and supported by $30 million from the U.S. Department of War to strengthen the defense industrial base.

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TTM Technologies, Inc. celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board (PCB) manufacturing facility in Syracuse, New York. The $130 million investment strengthens the U.S. defense electronics industrial base by establishing domestic production capacity for advanced microelectronics. This expansion directly supports next-generation radar, missile defense, space, and autonomous systems programs.
The new facility spans 215,000 square feet on TTM's existing Syracuse campus. It is among the first in the nation purpose-built for Ultra-HDI PCB and advanced packaging production. The project will create up to 400 new engineering and manufacturing jobs, increasing TTM's total Central New York workforce to approximately 1,000 employees.
"This is more than a facility — it is a statement about where American defense manufacturing is headed," said Cathie Gridley, EVP and President of Aerospace & Defense at TTM Technologies. She emphasized that the investment strengthens the U.S. microelectronics supply chain and positions TTM to support next-generation defense and national security technologies for decades.
Strategic Investment and Funding
The total investment of $130 million includes a $30 million contribution from the U.S. Department of War. This funding recognizes the facility's strategic importance to national security and aligns with the domestic microelectronics revival. The project addresses a critical gap in the U.S. defense industrial base, where domestic production capacity for these advanced board technologies has been severely limited.
Operational Capabilities
Ultra-HDI PCBs enable unprecedented miniaturization and performance density in advanced electronics. The Syracuse facility will produce these essential components for aerospace and defense programs. Until now, the majority of global manufacturing for these technologies has been concentrated in Asia.
| Metric | Detail |
|---|---|
| Total Investment | $130 million |
| Department of War Funding | $30 million |
| New Jobs Created | 400 |
| Total Central New York Workforce | ~1,000 |
| Facility Size | 215,000 square feet |
The facility builds on TTM's more than 60-year manufacturing presence in Syracuse. First announced in November 2023, the project was marked by a beam-signing ceremony attended by Governor Kathy Hochul in October 2024.
What is the expected timeline for the facility to reach full operational capacity and begin volume production?
How will TTM secure the specialized talent required to fill the 400 new engineering and manufacturing roles?
Are there plans to leverage this Ultra-HDI capability for commercial sectors beyond aerospace and defense?




























