Schmid shares advance as AI demand boosts orders
Schmid Group N.V. reported over €26 million in new orders since mid-May 2026, fueled by demand for AI infrastructure and optical module technologies. The orders, primarily from Asia, focus on HDI-ML and mSAP applications for high-performance electronics. Additionally, the company announced a strategic expansion in China to double manufacturing capacity by mid-2027.

*this image is generated using AI for illustrative purposes only.
Schmid Group N.V. saw its shares rise more than 10% on Tuesday after reporting a combined order intake of over €26 million since mid-May 2026, driven by customer investments in advanced PCB and substrate manufacturing technologies for AI infrastructure. The German technology company, listed on NASDAQ under the ticker SHMD, attributed the demand to the build-out of next-generation optical module supply chains and high-performance electronics. This surge in orders underscores sustained market momentum in high-density interconnect technologies as the industry transitions from evaluation to capacity investment.
The recent wins cover InfinityLine Production Equipment for High-Density Interconnect Multilayer (HDI-ML) and modified Semi-Additive Processing (mSAP) applications. These technologies serve AI servers, high-speed networking, optical communication modules, and advanced interconnect platforms. Roland Rettenmeier, Chief Sales Officer of Schmid Group, highlighted that the equipment delivers process stability and manufacturing precision required to support yield performance above 99%, a decisive factor for profitable high-volume production.
Order Intake and Regional Performance
HDI-ML emerged as the strongest contributor to the recent order intake, with multiple investments linked to capacity expansion and technology upgrades for advanced multilayer printed circuit boards. The regional mix confirms structurally strong demand led by Asia's core electronics manufacturing ecosystem, with customers primarily in China, Taiwan, and South Korea, alongside selective expansion in Europe. Additionally, mSAP technology contributed to the business, reflecting the industry's shift toward finer-line PCB manufacturing for higher routing density and improved electrical performance.
Financial Overview
The following table summarizes the order intake figures disclosed by the company:
| Period | Order Intake |
|---|---|
| Since mid-May 2026 | > €26 million |
| January 1, 2026 – June 15, 2026 | ≈ €43 million |
Strategic Expansion in China
Separately, Schmid Group announced plans for a new company-owned manufacturing campus in Zhongshan, Guangdong Province, China. The Freudenstadt-based manufacturer signed preliminary agreements with local authorities to combine two leased facilities into a single company-owned campus. The site is expected to nearly double effective manufacturing capacity, with operations targeted around mid-2027.
Market Outlook
Schmid expects continued momentum in the HDI-ML and mSAP segments as customers accelerate capacity investments for the next phase of AI infrastructure build-out. The company forecasts a strong second half of 2026 and continued growth into 2027, supported by a strengthening pipeline and structural growth trends in advanced networking and high-density electronics manufacturing.
How will the planned Zhongshan campus impact Schmid Group's profit margins once operations commence in mid-2027?
What are the risks of relying heavily on the Asia-Pacific region given the current geopolitical trade tensions?
Can the current order momentum be sustained if AI infrastructure capital expenditures slow in late 2026?


























