MicroVision launches semiconductor unit to expand ASIC capabilities
MicroVision has launched MicroVision Semiconductor to expand its custom ASIC and mixed-signal design capabilities. Headquartered in Colorado Springs, the unit leverages over 30 years of experience to support next-generation lidar and photonics solutions. This initiative aligns with MicroVision's Lidar 2.0 strategy, aiming to deliver integrated perception systems across industrial, defense, and automotive markets.
*this image is generated using AI for illustrative purposes only.
MicroVision has launched MicroVision Semiconductor, a dedicated semiconductor organization aimed at expanding its capabilities in custom ASIC development and mixed-signal integrated circuits. Headquartered in Colorado Springs, Colorado, the new unit serves as the company's center of excellence for semiconductor innovation. It continues to provide custom design services for an established portfolio of customers across multiple industries while enhancing MicroVision's ability to develop integrated perception systems.
The launch of MicroVision Semiconductor represents a significant step in the company's Lidar 2.0 strategy, which focuses on delivering tightly integrated perception systems. By combining world-class semiconductor engineering with its expanding lidar, software, and photonics technologies, MicroVision aims to strengthen its product roadmap. The organization brings together more than 30 years of semiconductor innovation and experience in delivering over 300 custom mixed-signal integrated circuit designs.
MicroVision Semiconductor offers a comprehensive range of ASIC development services, spanning from product concept through production. These capabilities are designed to support applications in lidar, machine vision, autonomous systems, and scientific imaging. The Colorado Springs team's infrastructure, including in-house laboratories and validation capabilities, allows customers to move efficiently from concept to market while reducing development risk.
Key Capabilities
The new organization provides expertise across several critical areas of semiconductor design and production:
| Capability | Description |
|---|---|
| Custom mixed-signal ASIC design | Development of tailored integrated circuits |
| Analog and pixel-oriented imaging architectures | Advanced imaging system design |
| High-performance ROIC development | Readout integrated circuit solutions |
| RF, memory, and high-speed A/D conversion | Specialized high-speed data conversion |
| Automotive-qualified electronics | Functional safety and automotive compliance |
| Radiation-hardened designs | Solutions for defense and aerospace |
| Packaging and validation | Complete production testing support |
Strategic Impact
MicroVision Semiconductor plays a crucial role in advancing the company's internal technology roadmap, particularly in developing next-generation photonic integrated circuits (PICs) for FMCW lidar initiatives. The company's transformation has been supported by strategic acquisitions and technology integrations to expand capabilities across the perception stack. This expansion positions MicroVision to address increasing demand for intelligent perception systems in industrial automation, security, defense, and automotive sectors.
Market Applications
MicroVision's growing portfolio supports a wide array of applications, leveraging the new semiconductor capabilities to deliver differentiated solutions. The company expects these investments to strengthen its ability to serve customers while creating new opportunities for innovation in semiconductor and photonics technologies.
How will the establishment of MicroVision Semiconductor impact the company's R&D expenses and profitability timeline?
What are the potential revenue contributions from third-party ASIC services versus internal lidar system development?
How might this vertical integration affect MicroVision's partnerships with existing chip suppliers?

































