Highness Microelectronics showcases display tech at SEMICON India 2026
- Highness Microelectronics showcased glass cutting and CoG/FoG bonding at SEMICON India 2026
- Company highlighted India's first automated glass cutting line at Rabale facility
- Upcoming Goa plant will integrate glass processing, backlight assembly, and testing
- Won 'Display Rising Star Award' at India Display Conference 2026
- IPO raised ₹21.67 crore; listed on BSE SME on April 2, 2026

*this image is generated using AI for illustrative purposes only.
Highness Microelectronics Limited participated in SEMICON India 2026, held from September 17, 2026 to September 19, 2026 in New Delhi. The company showcased its advanced glass cutting and bonding capabilities, highlighting its transition from assembly to full-scale manufacturing.
The event, inaugurated by Prime Minister Narendra Modi and Union Minister Ashwini Vaishnaw, brought together over 500 exhibitors. Highness, represented by Managing Director Gaurav Kejriwal, displayed technologies including Chip-on-Glass (CoG) and Film-on-Glass (FoG) bonding. Chief Strategy Officer Pradeep Sharma addressed the audience on the company’s growth trajectory and expansion plans.
Manufacturing Capabilities
Highness demonstrated its vertical integration progress, moving beyond simple assembly to include precision glass processing. The Rabale facility in Navi Mumbai now features India’s first automated glass cutting line, allowing custom sizing of mother glass sheets. This capability supports niche sectors such as defence, aerospace, and medical imaging, where specific dimensions and reliability are critical.
The company also highlighted its clean-room assembly operations, classified as ISO-certified Class 10,000 and Class 1,000 environments. These facilities enable dust-free electronic integration, ensuring high-quality output for sensitive applications like surgical monitors and avionics displays.
Expansion Plans
A key focus at the event was the upcoming integrated facility in Tuem, Goa. This new site will consolidate glass processing, backlight assembly, and final module testing under one roof. By localizing CoG and FoG bonding technologies, Highness aims to reduce dependency on external vendors and shorten turnaround times.
The Goa expansion complements the existing Rabale operations, creating a dual-site manufacturing strategy. This approach is designed to enhance capacity and support the company’s goal of achieving higher localization levels for domestic and international clients.
Industry Recognition
Highness Microelectronics was honoured with the ‘Display Rising Star Award’ at the India Display Conference 2026, held alongside SEMICON. Harit Doshi, President-Elect of the Society for Information Display, praised the company’s pace of innovation and execution in vertically integrating display module manufacturing.
The company also strengthened ties with Noritake Itron Corporation, a Japanese electronics manufacturer. Fumihiko Mizutani, Sales Head for Noritake’s India region, commended Highness as a reliable distribution partner during the event.
Corporate Background
Highness Microelectronics Limited successfully raised ₹21.67 crore through its Initial Public Offering (IPO) and was listed on the BSE SME platform on April 2, 2026. The company specialises in digital imaging solutions, serving sectors including Defence & Aerospace, Railways, Medical & Healthcare, and Industrial Automation.
Historical Stock Returns for Highness Microelectronics
| 1 Day | 5 Days | 1 Month | 6 Months | 1 Year | 5 Years |
|---|---|---|---|---|---|
| +1.68% | 0.0% | +42.13% | +150.65% | +131.14% | +131.14% |
How will the completion of the integrated facility in Tuem, Goa, impact Highness Microelectronics' production capacity and cost structure in the next 12-18 months?
What specific regulatory or supply chain challenges might Highness face in achieving higher localization levels for defence and aerospace clients compared to commercial sectors?
Given the strengthened partnership with Noritake Itron Corporation, are there plans to expand this distribution model to other global electronics manufacturers in the near future?































