Highness Microelectronics Limited management will interact with institutional investors and analysts during the Arihant Bharat Connect Conference Rising Star on September 30, 2026. The event is organized by Arihant Capital and will be conducted in virtual mode.

The company filed an intimation with the BSE on September 22, 2026, pursuant to Regulation 30(6) of the SEBI (Listing Obligations and Disclosure Requirements) Regulations, 2015. This regulation mandates disclosure of interactions with analysts and institutional investors to ensure fair market access.

Event Details

The scheduled interaction focuses on publicly available information only. The company explicitly stated that no unpublished price sensitive information (UPSI) is intended to be discussed during the session.

Regulatory Compliance and Notes

The filing was signed by Gaurav Kejriwal, Managing Director of Highness Microelectronics. The company noted that the schedule for the meeting is subject to change due to exigencies involving the analysts, institutional investors, or the company itself. Stakeholders are advised to treat the provided schedule as provisional.

Highness Microelectronics Limited participated in SEMICON India 2026, held from September 17, 2026 to September 19, 2026 in New Delhi. The company showcased its advanced glass cutting and bonding capabilities, highlighting its transition from assembly to full-scale manufacturing.

The event, inaugurated by Prime Minister Narendra Modi and Union Minister Ashwini Vaishnaw, brought together over 500 exhibitors. Highness, represented by Managing Director Gaurav Kejriwal, displayed technologies including Chip-on-Glass (CoG) and Film-on-Glass (FoG) bonding. Chief Strategy Officer Pradeep Sharma addressed the audience on the company’s growth trajectory and expansion plans.

Manufacturing Capabilities

Highness demonstrated its vertical integration progress, moving beyond simple assembly to include precision glass processing. The Rabale facility in Navi Mumbai now features India’s first automated glass cutting line, allowing custom sizing of mother glass sheets. This capability supports niche sectors such as defence, aerospace, and medical imaging, where specific dimensions and reliability are critical.

The company also highlighted its clean-room assembly operations, classified as ISO-certified Class 10,000 and Class 1,000 environments. These facilities enable dust-free electronic integration, ensuring high-quality output for sensitive applications like surgical monitors and avionics displays.

Expansion Plans

A key focus at the event was the upcoming integrated facility in Tuem, Goa. This new site will consolidate glass processing, backlight assembly, and final module testing under one roof. By localizing CoG and FoG bonding technologies, Highness aims to reduce dependency on external vendors and shorten turnaround times.

The Goa expansion complements the existing Rabale operations, creating a dual-site manufacturing strategy. This approach is designed to enhance capacity and support the company’s goal of achieving higher localization levels for domestic and international clients.

Industry Recognition

Highness Microelectronics was honoured with the ‘Display Rising Star Award’ at the India Display Conference 2026, held alongside SEMICON. Harit Doshi, President-Elect of the Society for Information Display, praised the company’s pace of innovation and execution in vertically integrating display module manufacturing.

The company also strengthened ties with Noritake Itron Corporation, a Japanese electronics manufacturer. Fumihiko Mizutani, Sales Head for Noritake’s India region, commended Highness as a reliable distribution partner during the event.

Corporate Background

Highness Microelectronics Limited successfully raised ₹21.67 crore through its Initial Public Offering (IPO) and was listed on the BSE SME platform on April 2, 2026. The company specialises in digital imaging solutions, serving sectors including Defence & Aerospace, Railways, Medical & Healthcare, and Industrial Automation.