Cadence expands Intel Foundry collaboration for Intel 14A optimization

1 min read     Updated on 09 Jun 2026, 03:18 AM
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AI Summary

Cadence and Intel Foundry have expanded their multi-year collaboration to advance Design Technology Co-Optimization (DTCO) targeting Intel's next-generation process technologies, starting with Intel 14A. The agreement combines Cadence's agentic AI-driven EDA and Design IP solutions with Intel's process innovation to deliver production-ready PDKs and improve performance, power, and area (PPA). Executives from both companies highlighted the partnership's role in accelerating time-to-market and reducing design risk for customers.

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Cadence has expanded its collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel's next-generation process technologies, beginning with Intel 14A. This multi-year agreement combines Cadence's agentic AI-driven EDA and Design IP solutions with Intel's process innovation and advanced design expertise to accelerate customer innovation. The partnership aims to deliver production-ready Process Design Kits (PDKs) and reduce design risk for high-performance computing and mobile designs.

The DTCO collaboration focuses on optimizing tools, flows, and methodologies to deliver industry-leading performance, power, and area (PPA). Cadence and Intel will work closely to optimize Intel 14A to deliver production-ready PDKs. The partnership will also leverage Cadence's agentic AI flows and core products to accelerate time-to-market and reduce design risk.

"Advancing our relationship with Intel into a much deeper partnership is a major milestone for both companies," said Anirudh Devgan, president and chief executive officer, Cadence. "This collaboration will leverage the strengths of both companies to empower customers to unlock new levels of performance, power, and efficiency, advance the state of the art and accelerate the realization of next-generation products."

"Our expanded collaboration with Cadence reflects Intel Foundry's continued focus on delivering on its technology roadmap and ecosystem on behalf of our customers," said Naga Chandrasekaran, executive vice president and general manager of Intel Foundry. "By combining Intel's process and packaging with Cadence's AI-driven design tools, we are enabling deeper co-optimization, strengthening our ability to deliver on customers' needs, and showcasing the ability of both companies to drive innovation at scale."

Key Collaboration Areas

The expanded cooperation spans several critical areas of development:

  • DTCO: Joint optimization of design and process technologies.
  • IP Readiness: Ensuring intellectual property is prepared for advanced nodes.
  • Design Enablement: Providing tools and methodologies for efficient design implementation.

How will the integration of Cadence's agentic AI flows into Intel 14A development influence the competitive landscape against TSMC and Samsung?

What specific timeline milestones can be expected for the release of production-ready PDKs for Intel 14A under this agreement?

Could this multi-year collaboration pave the way for similar AI-driven DTCO partnerships with other major foundries?

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