Amber Enterprises India Limited conducted the groundbreaking ceremony for two advanced manufacturing facilities at YIEDA, near Noida International Airport in Jewar, Uttar Pradesh, on June 27, 2026. The event marks a decisive step in the group's expansion to build large-scale technology-intensive manufacturing capabilities, further advancing the vision of 'Aatmanirbhar Bharat'. The ceremony was attended by key dignitaries including Shri Yogi Adityanath, Hon'ble Chief Minister of Uttar Pradesh, and Shri Ashwini Vaishnaw, Hon'ble Union Minister for Railways, Information & Broadcasting, Electronics & Information Technology.

The new projects include a facility for advanced HDI PCBs manufacturing by Ascent-K Circuit Private Limited, spanning 16 acres, and an Ultra Mega AC manufacturing facility by Amber Group spanning 100 acres. The PCB facility is approved under the Electronics Component Manufacturing Scheme (ECMS) by the Ministry of Electronics and Information Technology (MeitY) and brings together the expertise of Ascent Circuits and Korea Circuit Co. The AC facility aims to boost domestic production and scale in a phased manner.

Key Details

Mr. Jasbir Singh, Executive Chairman and CEO of Amber Group, stated that the expansion will deepen domestic value addition and foster innovation in the highly import-dependent PCB segment, while creating employment opportunities in the state of Uttar Pradesh. The disclosure was made pursuant to Regulation 30 of the Securities and Exchange Board of India (Listing Obligations and Disclosure Requirements) Regulations, 2015.

Amber Enterprises India Limited and Schweizer Electronic AG intend to enter a strategic cooperation in the field of printed circuit boards (PCBs) to strengthen supply chain resilience for customers in the European and US regions. The partnership involves IL JIN Electronics (India) Pvt. Limited, part of the Amber Group, which operates its bare PCB business through its subsidiaries, specifically focusing on Ascent Circuits. This collaboration aims to create additional value by broadening sourcing options and preparing a structured path toward future technology capabilities.

The planned cooperation will combine Schweizer's long-standing experience in automotive and industrial PCB applications with Ascent Circuits' manufacturing footprint and expansion plans in India. By aligning complementary strengths, the companies intend to build a scalable platform for future growth while addressing the increasing importance of diversified, reliable, and geopolitically resilient supply chains in the global electronics industry.

In the first phase, the partners will concentrate on selected standard automotive and industrial PCB applications based on existing manufacturing capabilities. Parallel to this, the cooperation will develop a step-by-step roadmap toward more complex multilayer and High-Density Interconnect (HDI) applications as future Indian capacities become available. A key element of the cooperation will be the alignment of customer requirements, technical capabilities, capacity needs, and commercial competitiveness.

High quality, qualification, and process standards will play a critical role in meeting the expectations of demanding automotive and industrial customers. The partners also plan to evaluate selected future growth areas in other industries where the cooperation can generate long-term customer value. For customers, this collaboration offers additional options in a changing market environment.

Key Aspects of the Cooperation