MosChip Technologies Issues Postal Ballot Notice for Director Appointments and Remuneration

MosChip Technologies Limited has issued a formal postal ballot notice dated December 18, 2025, following the board meeting held on December 17, 2025. The notice seeks shareholder approval for critical corporate governance matters through remote e-voting.

Postal Ballot Schedule and Proposals

The postal ballot will be conducted from December 22, 2025 to January 20, 2026, covering three key resolutions requiring shareholder approval:

Proposal	Details
Independent Director 1	Mr. Sandeep Himmatlal Shah (DIN: 11273722) for 5 years w.e.f. October 24, 2025
Independent Director 2	Dr. Yellamanchali Sreenivas Rao (DIN: 11219939) for 5 years w.e.f. October 24, 2025
Remuneration Revision	Terms of remuneration for Mr. Srinivasa Rao Kakumanu, Managing Director & CEO

Managing Director Remuneration Details

The postal ballot notice reveals specific remuneration terms for Mr. Srinivasa Rao Kakumanu, effective from January 1, 2026 to March 31, 2027:

Component	Amount
Fixed Pay	₹3.06 crores per annum
Variable Pay	₹54.00 lakhs per annum (milestone-based)
Additional Benefits	Provident Fund, Gratuity, Medical Insurance, ESOP eligibility

Director Profiles and Qualifications

Mr. Sandeep Himmatlal Shah brings over 30 years of global experience in semiconductor, cloud, AI/ML, medical, and IoT sectors. He previously served as Sr. Director at Intel Corporation's Data Center Group and General Manager of Intel India. He founded Multus Medical in 2017 and North Star International Ventures.

Dr. Yellamanchali Sreenivas Rao contributes over four decades of experience in mechanical engineering and defence systems. He superannuated as Director General (Naval Systems & Materials) from DRDO and holds a Ph.D. in Mechanical Engineering from Osmania University.

E-Voting Process and Timeline

M/s BSS Associates, Practicing Company Secretaries, has been appointed as scrutinizer for the postal ballot process. The remote e-voting facility will be available through KFin Technologies Limited's platform.

Timeline	Details
E-Voting Start	Monday, December 22, 2025 (9:00 AM IST)
E-Voting End	Tuesday, January 20, 2026 (5:00 PM IST)
Cut-off Date	Friday, December 12, 2025
Result Declaration	Within two working days of e-voting conclusion

Employee Stock Options

In a separate decision, the Nomination and Remuneration Committee granted 124,384 Employee Stock Options (ESOPs) to eligible employees under the company's existing Stock Options Schemes, demonstrating the company's commitment to employee participation in growth.

1 Day	5 Days	1 Month	6 Months	1 Year	5 Years
-2.10%	-3.80%	-7.77%	+10.91%	+1.61%	+1.61%

MosChip Technologies , a global silicon and product engineering company, is poised to make waves at the upcoming Embedded World North America event with the launch of its innovative ProductXcelerate™ Blueprints. This new offering aims to revolutionize the way original equipment manufacturers (OEMs) approach product development in the AI-driven era.

Integrated Engineering for the AI-Led Product Era

ProductXcelerate™ Blueprints represent a significant leap forward in integrated engineering solutions. These pre-validated, vertical-ready reference designs are designed to unify various aspects of product development, including:

Hardware platforms
Embedded software stacks
MosChip DigitalSky GenAIoT™ modules
AgenticSky™ cores

The blueprints are built to meet compliance, interoperability, and scalability requirements, enabling OEMs to streamline their design and certification processes while confidently scaling across product lines.

Key Features of ProductXcelerate™ Blueprints

Feature	Description
Integrated Design	Unified hardware, software, digital, and AI lifecycle for next-gen product development
Pre-Validated & Vertical-Ready	SMARC-class modular design built for compliance and reuse
AI-Infused Architecture	DigitalSky GenAIoT™ for connectivity and intelligence; AgenticSky™ for adaptiveness and autonomy
Lifecycle-Continuous	OTA updates, traceability, and proactive optimization built-in

Accelerating OEM Innovation

Vishal Patil, Senior Vice President - Product Engineering BU at MosChip, emphasized the modular and integrated engineering model that ProductXcelerate™ Blueprints bring to product development. He stated, "By integrating leading hardware ecosystems with embedded software stacks, DigitalSky GenAIoT™ modules, and AgenticSky™ cores, we're enabling OEMs to assemble and evolve next-generation products faster than ever."

Live Demonstrations at Embedded World North America

MosChip plans to showcase several ProductXcelerate™ Blueprints at the event, demonstrating how pre-validated, integrated frameworks can accelerate OEM innovation across various sectors:

Automotive SDV Gateway Blueprint
Industrial & BMS Edge Gateway Blueprint
Retail Auto-Checkout Kiosk Blueprint
Home Automation Bridge Blueprint
Wearable Companion Blueprint

These demonstrations aim to illustrate how MosChip's pre-validated blueprints can minimize integration effort, enable compliance, and establish a foundation for continuous intelligence.

The Future of Product Development

Sribash Dey, Senior Vice President – NA & Europe Sales at MosChip, highlighted the importance of rapid and reliable product development in today's market. He noted, "ProductXcelerate™ Blueprints enable that transformation - turning engineering concepts into agentic products that evolve with intelligence and speed, ready for the AI-led product era."

As the industry moves towards more intelligent and connected products, MosChip Technologies' ProductXcelerate™ Blueprints appear poised to play a significant role in shaping the future of product development for OEMs across various sectors.