SMIC, Hua Hong Lead China's Advanced Semiconductor Manufacturing Expansion
China's semiconductor expansion is being led by major domestic players including SMIC, Hua Hong Semiconductor, and Huawei-linked companies, who are expanding to produce chips using the most advanced technology available in China. The initiative supports broader targets of adding 500,000 wafer capacity by 2030 and boosting advanced chip output to 100,000 wafers within 1-2 years.

*this image is generated using AI for illustrative purposes only.
China's semiconductor manufacturing expansion is being spearheaded by major domestic chipmakers, including SMIC, Hua Hong Semiconductor, and several Huawei-linked companies, according to sources cited by Nikkei. These companies are expanding operations to begin producing chips using the most advanced technology currently available in China.
Key Players in Expansion
The strategic initiative is being driven by China's leading semiconductor manufacturers working to enhance domestic chip production capabilities:
| Company Type: | Details |
|---|---|
| Leading Foundries: | SMIC, Hua Hong Semiconductor |
| Strategic Partners: | Several Huawei-linked chipmakers |
| Technology Focus: | Most advanced available in China |
Comprehensive Capacity Targets
The broader expansion plan encompasses substantial capacity increases with specific timelines for implementation:
| Target: | Capacity | Timeline |
|---|---|---|
| Total Wafer Capacity Addition: | 500,000 wafers | By 2030 |
| Advanced Chip Output: | 100,000 wafers | Within 1-2 years |
Strategic Focus on Advanced Manufacturing
The involvement of major players like SMIC and Hua Hong Semiconductor, along with Huawei-linked companies, underscores China's commitment to developing cutting-edge semiconductor manufacturing capabilities. The plan places particular emphasis on producing relatively advanced chips using the most sophisticated technology currently accessible to Chinese manufacturers.
Long-term Infrastructure Development
The comprehensive expansion represents a substantial investment in China's semiconductor manufacturing infrastructure, with the broader capacity target of adding 500,000 wafers by 2030 indicating the country's strategic commitment to building robust domestic chipmaking capabilities across various technology nodes and applications.

























