Teradyne, Inc. has launched an integrated test cell solution designed to support known good device (KGD) screening for devices utilized in AI and data center applications. Developed in collaboration with Tokyo Electron (TEL™), the solution addresses the need for high-quality screening at multiple stages of the advanced packaging flow. This integration provides a production-ready path for fabless designers, foundries, and OSATs to ensure device reliability in complex 2.5D/3D packages.

The new solution pairs Teradyne's UltraFLEXplus platform with Tokyo Electron's Prexa™ SDP (Singulated Device Prober). By combining these technologies, the companies aim to deliver efficient screening capabilities specifically tailored for the rigorous demands of advanced semiconductor packaging. The UltraFLEXplus platform serves as the test engine, while the Prexa SDP handles the physical probing of singulated devices.

Technical Integration

The collaboration leverages the strengths of both companies' core technologies to create a seamless testing environment. The integrated test cell is intended to streamline the screening process, reducing the risk of defective devices progressing further in the supply chain.

This joint effort targets the growing complexity of AI hardware and data center infrastructure, where ensuring the integrity of individual components before final assembly is critical.