Paras Defence unit signs MoU for ₹6,200 Cr semiconductor facility
Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies Limited, has signed an MoU with the Government of Madhya Pradesh to set up a ₹6,200 crore advanced semiconductor packaging OSAT facility on fifty acres of land in the Ujjain–Indore Corridor. The project aligns with the state's Semiconductor Policy 2025 and aims to build indigenous capabilities for strategic applications, including sensor technologies and AI chips, while generating significant employment.

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Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies Limited , has signed a Memorandum of Understanding (MoU) with the Government of Madhya Pradesh to establish an advanced semiconductor packaging OSAT facility. The agreement includes the allotment of fifty acres of land on the Ujjain–Indore Corridor, backed by a proposed investment of ₹6,200 crore. This strategic initiative aims to strengthen India's semiconductor manufacturing ecosystem, accelerate the development of devices for strategic applications, and generate significant employment opportunities in the state.
Project Overview
The greenfield facility is designed to undertake advanced packaging operations critical for the semiconductor supply chain. The project aligns with the Government of Madhya Pradesh's Semiconductor Policy 2025 and the state's broader vision of developing an integrated ecosystem for semiconductors and advanced technologies. The Ujjain–Indore Corridor is emerging as a key technology and manufacturing corridor, supported by progressive policy initiatives and infrastructure.
| Aspect | Details |
|---|---|
| Partner | Government of Madhya Pradesh |
| Location | Ujjain–Indore Corridor, Madhya Pradesh |
| Land Allotment | Fifty acres |
| Investment | ₹6,200 crore |
| Facility Type | Greenfield advanced IC packaging OSAT |
Scope of Operations
Paras Semiconductors has been established to build advanced semiconductor capabilities for strategic and high-performance sensor applications. The facility will focus on developing semiconductor devices for sensor technologies, optical and optronic systems, and other strategic applications. It also offers the potential to support future expansion into AI chips and other advanced semiconductor technologies as market opportunities evolve.
Munjal Sharad Shah, Managing Director of Paras Defence and Space Technologies Ltd., highlighted the significance of the MoU, stating it marks a milestone in building indigenous capabilities. Santosh Kumar, Chief Executive Officer of Paras Semiconductor, emphasized that the project aims to strengthen domestic technology capabilities and contribute to India's long-term technological self-reliance. The intimation was submitted to the exchanges under Regulation 30 of the SEBI (Listing Obligations and Disclosure Requirements) Regulations, 2015.
Historical Stock Returns for Paras Defence Space Tech
| 1 Day | 5 Days | 1 Month | 6 Months | 1 Year | 5 Years |
|---|---|---|---|---|---|
| -2.09% | -1.59% | -13.15% | +84.76% | +47.57% | +386.33% |
What is the projected timeline for the facility to become operational and begin commercial production?
How will the ₹6,200 crore investment be funded, and will it rely on debt, equity, or government subsidies?
Which specific global or domestic customers are targeted for the advanced packaging services?


































