Longsys achieves one million monthly mSSD production capacity
Longsys achieved a stable monthly production capacity of one million mSSD units in June 2026, utilizing SiP integration technology to manufacture PCIe Gen4 and Gen5 solutions. The company is collaborating with Lenovo and ASUS to deploy these storage solutions for edge AI devices, AI PCs, and intelligent terminals.
*this image is generated using AI for illustrative purposes only.
Longsys announced the establishment of a stable monthly production and delivery capacity of one million mSSD (Micro SSD) units in June 2026. This milestone marks a significant advancement in the company's high-speed storage solutions, designed to meet growing market demand and support future expansion. The production ramp-up follows the initial rollout of mSSD samples at the company's Suzhou packaging and testing manufacturing base in October 2025.
The new capacity leverages System-in-Package (SiP) integration and packaging technology to innovate traditional storage form factors. The performance, quality, and functionality of these products have been validated through real-world customer applications. Longsys is currently working with leading industry customers, including Lenovo and ASUS, to integrate these solutions.
Product Specifications and Technology
Longsys currently offers both PCIe Gen4 and PCIe Gen5 mSSD solutions. These products are designed with customized thermal architectures to deliver sustained high performance within a compact form factor suitable for edge AI devices. The PCIe Gen5 version incorporates a vapor chamber (VC) cooling solution to support higher bandwidth, larger capacities, and improved sustained performance under intensive workloads.
The mSSD adopts a SiP architecture that integrates the controller, NAND flash, power management IC, and passive components into a single package. Compared to conventional PCB-based SSD designs, this architecture simplifies manufacturing, improves space efficiency, enhances product reliability, and shortens production cycles.
| Feature | Specification |
|---|---|
| Architecture | System-in-Package (SiP) |
| Interface | PCIe Gen4, PCIe Gen5 |
| Cooling (Gen5) | Vapor Chamber (VC) |
| Production Capacity | 1 million units/month |
Strategic Developments
The SiP integration solution is compatible with multiple generations of high-speed PCIe specifications, including Gen4, Gen5, and the upcoming Gen6. It delivers product development capabilities covering consumer-grade, industrial-grade, and automotive-grade reliability standards.
To strengthen its edge AI storage portfolio, Longsys introduced its proprietary SPU (Storage Processing Unit), iSA (Intelligent Storage Agent), and HLCache technologies in March 2026. These technologies create an integrated hardware-software architecture for next-generation intelligent storage.
Looking ahead, Longsys plans to expand its mSSD platform across AI PCs, AI Boxes, and other edge AI devices while advancing the PCIe Gen5 ecosystem. The company aims to accelerate the large-scale deployment of edge AI storage solutions by combining SiP integration with hardware-software innovation.
How will Longsys manage the supply chain logistics to sustain the one million unit monthly capacity given the volatility in NAND flash pricing?
What is the projected cost per unit of the SiP-based mSSD compared to traditional PCB-based SSDs, and how will this impact pricing in the edge AI market?
When does Longsys anticipate the commercial availability of PCIe Gen6 solutions based on their current SiP architecture roadmap?
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