Intel hires former SK Hynix CEO to lead advanced packaging as Apple partnership fuels foundry revival
Intel appointed former SK Hynix and SK On CEO Seok-Hee Lee as EVP of Intel Foundry to lead advanced packaging and system integration. The restructuring splits manufacturing leadership, with Naga Chandrasekaran focusing on front-end technologies like 18A and 14A. This follows recent initiatives, including hiring former Samsung executive Shawn Han and securing Tesla as a customer for 14A chips. Additionally, Apple agreed to work with Intel for U.S. chip manufacturing, and the U.S. government invested $8.9 billion for a 9.9% stake.

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Intel Corporation has appointed former SK Hynix and SK On chief executive Seok-Hee Lee as executive vice president of its contract chip-manufacturing business, Intel Foundry. Lee will report directly to CEO Lip-Bu Tan and oversee advanced packaging, system integration, back-end technology development, and back-end manufacturing. This strategic move establishes advanced packaging as a focused business unit to address the growing complexity and importance of packaging in AI systems.
Strategic Focus on Advanced Packaging
The appointment reflects the evolving Intel Foundry strategy, positioning advanced packaging as a key enabler for performance, power efficiency, and heterogeneous integration. "Advanced packaging and system integration are becoming defining capabilities for next-generation computing systems," said Lip-Bu Tan, Intel CEO. He highlighted Lee's expertise in leading complex, high-scale technology and manufacturing organizations as critical for scaling technologies like EMIB-T and HBI to high volume.
Leadership Changes and Responsibilities
As part of the restructuring, Executive Vice President Naga Chandrasekaran will concentrate on front-end technology development and manufacturing, with a focus on accelerating production of the company's 18A, 14A, and future process technologies. His focus remains on accelerating the ramp of these nodes, alongside design enablement and customer-facing functions. This operating model aims to reinforce Intel's commitment to delivering speed, consistency, and predictability for customers and partners.
Executive Profile and Transition
Lee joins Intel from SK On, where he served as president and CEO, and previously held the same role at SK Hynix. A semiconductor veteran, he has also held engineering leadership roles at Intel and in academia. "Intel Foundry has a significant opportunity ahead, and I look forward to partnering with Naga and the entire Intel Foundry leadership team," said Lee. Additionally, executive vice president Navid Shahriari will retire after a distinguished 37-year career at the company.
Foundry Initiatives and Partnerships
The leadership change follows several recent foundry initiatives. In April, Intel hired former Samsung foundry executive Shawn Han to support its manufacturing efforts. The company also secured Tesla Inc. as the first major customer for its next-generation 14A process, which is expected to enter mass production in 2029. Furthermore, President Donald Trump announced that Apple Inc. has agreed to work with Intel to design and manufacture chips in the U.S., potentially providing a major boost to Intel's contract manufacturing business.
Financial and Market Impact
In August, the U.S. government invested $8.9 billion in Intel, purchasing 433.3 million shares at $20.47 each and securing a 9.9% passive ownership stake under the CHIPS Act and Secure Enclave initiatives. Shares of INTC surged 10.64% to close at $133.99 on Thursday and edged up another 0.13% to $134.16 in after-hours trading. According to Benzinga Edge Stock Rankings, Intel's Momentum score sits in the 99th percentile, indicating strong price performance across short, medium, and long-term periods.
How will Lee's leadership influence Intel's ability to scale advanced packaging technologies like EMIB-T and HBI to meet AI market demands?
What impact will the separation of front-end and back-end operations have on Intel's timeline for ramping up 18A and 14A process nodes?
How might the collaboration with Apple under the Secure Enclave initiatives alter Intel's competitive position in the contract manufacturing market?



























