SanDisk, Micron, Western Digital Extend AI Memory Selloff
Memory stocks including SanDisk, Micron, and Western Digital face renewed selling pressure due to concerns over Chinese advancements in lithography and commodity chips. However, analysts highlight that high-bandwidth memory (HBM) demand remains robust, supported by multi-billion dollar supply agreements with Nvidia and other tech giants.

*this image is generated using AI for illustrative purposes only.
Shares of SanDisk Corp., Micron Technology Inc., and Western Digital Corp. extended sharp declines on Tuesday, as the artificial intelligence-linked memory trade faced mounting pressure from fears of Chinese competition. SanDisk fell over 11%, Micron dropped more than 8%, and Western Digital lost another 12%, while Seagate Technology Holdings plc sank nearly 10%. The selloff reflects a broader reassessment of valuations across the semiconductor sector, with investors unwinding positions after a prolonged rally driven by AI infrastructure spending.
The weakness stems largely from concerns that China is rapidly closing the technology gap in memory chips. ChangXin Memory Technologies (CXMT), China’s state-backed memory champion, stunned investors with a 466% first-day gain following its Shanghai IPO. Additionally, reports that Chinese manufacturers have begun mass-producing domestic deep ultraviolet (DUV) lithography systems have fueled fears that future supply could expand faster than expected, potentially pressuring global pricing.
Diverging Views on Competitive Threats
Analysts remain divided on the severity of the threat posed by Chinese manufacturers. Nic Puckrin, cross-asset analyst at Coin Bureau, described the situation as a “DeepSeek moment” for chip makers, suggesting that market psychology may outweigh fundamental earnings results. He noted that even record financial performance might struggle to reverse sentiment if expectations remain excessively high.
Conversely, Counterpoint Research analyst MS Hwang argues that Chinese progress is concentrated primarily in commodity DRAM and NAND, rather than the high-bandwidth memory (HBM) chips powering Nvidia’s AI accelerators. Hwang stated that Chinese suppliers may not manufacture HBM3 until the first half of 2027, by which time Micron, SK Hynix, and Samsung are expected to have moved into HBM4 production.
Long-Term Supply Agreements Remain Intact
Despite the near-term volatility, long-term structural demand for advanced memory appears secure. Industry reports indicate that Nvidia has secured multi-year HBM supply agreements worth as much as $500 billion with SK Hynix. Collectively, Nvidia, SK Hynix, Samsung, and Broadcom have locked in nearly $950 billion of long-term HBM supply commitments.
Yuri Khodjamirian, chief investment officer at Tema ETFs, emphasized that the market remains undersupplied well into 2028. He argued that investors are conflating China’s advance in commodity memory with leadership in AI-specific memory. “I don’t think U.S. AI builders are going to be using HBM from China,” Khodjamirian said, noting that certification processes for HBM are rigorous and difficult to replicate quickly.
Technical Outlook and Earnings Ahead
SanDisk shares were down 5.58% at $1,206.92 during premarket trading on Tuesday. Despite the recent correction, SanDisk remains up more than 2,950% over the past 12 months. The stock is scheduled to report quarterly results on August 5, with Wall Street expecting significant year-over-year improvement.
| Metric: | Current Estimate | Prior-Year Period |
|---|---|---|
| Earnings Per Share: | $33.38 | $0.29 |
| Revenue: | $8.24 billion | $1.90 billion |
| Analyst Consensus: | Buy | — |
Short-term technical indicators suggest continued weakness. The 20-day simple moving average (SMA) has crossed below the 50-day SMA, a bearish signal. However, the 50-day SMA remains above the 200-day SMA, indicating the longer-term uptrend is intact. Key support sits near $998.65, while resistance is located around $1,308.68.
How might the certification barriers for HBM impact the timeline for Chinese manufacturers to penetrate the AI accelerator supply chain beyond 2027?
Could the divergence between commodity memory pricing pressure and HBM demand lead to a structural split in valuations between traditional and AI-focused semiconductor firms?
What specific geopolitical or regulatory measures might U.S. policymakers implement if Chinese DUV lithography production scales faster than anticipated?

































