QTREX Quantum Ltd. announced that one of the largest U.S.-based interconnect manufacturers has moved its Additively Manufactured Electronics (AME) system from a development environment onto its production floor. The transition follows an extensive validation program where the AME technology achieved a 97% yield. This milestone represents a significant validation for the production of high-density interconnect structures using AME-enabled processes.

The U.S.-based manufacturer, a provider of high-performance interconnect solutions for quantum computing, utilized QTREX's technology to produce multiple components. The validation program encompassed hundreds of technical and process evaluations, including assessments of reliability, mechanical vibration, environmental exposure, humidity, and assembly integration.

Addressing Manufacturing Challenges

Advanced electronics manufacturers face increasing pressure to deliver higher-density interconnects and improved thermal management while meeting stringent signal-integrity requirements. Conventional manufacturing methods struggle to address these challenges. QTREX's AME technology bridges this gap by enabling complex 3D structures that integrate dielectric and conductive materials into a single monolithic unit.

Strategic Implications

"Moving from validation to the production floor at one of the largest U.S.-based interconnect manufacturers is a major commercial and technological milestone for QTREX," said Dagi Ben-Noon, Chief Executive Officer of QTREX. He noted that the 97% yield demonstrates the system's readiness for demanding production environments. This development strengthens QTREX's position as a platform for manufacturing infrastructure required for scalable quantum computing systems.

The production deployment is expected to support broader adoption by leading quantum companies and advanced electronics customers. QTREX continues to advance engagements focused on high-performance connectivity and quantum infrastructure applications.

QTREX Quantum Ltd. has secured an approximately $1 million grant from the Israel Innovation Authority (IIA) to advance the development of a native RF dielectric material for scalable superconducting quantum computing systems. The funding targets the creation of a purpose-built dielectric material engineered for high-density, low-loss RF signal routing in cryogenic environments. This initiative addresses a critical bottleneck in the industry, where scaling quantum processors requires more RF lines, tighter packaging, and cleaner signal paths with lower thermal impact.

The program focuses on integrating the dielectric material as a native layer within QTREX's quantum connectivity architecture. By engineering the dielectric, conductor, and 3D geometry together, the company aims to overcome the limitations of adapting off-the-shelf materials for quantum requirements. In superconducting quantum systems, signal loss, impedance control, density, and thermal behavior are determined by the interplay of these components as a single structure.

"Superconducting quantum computers cannot scale on conventional wiring architecture," said Dagi Ben-Noon, Chief Executive Officer of QTREX. He noted that the company's existing materials and Additively Manufactured Electronics (AME) capabilities enable the engineering of materials, conductive pathways, and 3D geometry as an integrated platform. The grant is expected to enhance this core materials layer and support upcoming technical and commercial discussions with quantum hardware companies.

QTREX Quantum Ltd. is a technology company focused on advanced connectivity and electronics manufacturing solutions for next-generation hardware markets. Following its acquisition of the AME platform, the company is developing high-density, thermally optimized quantum connectivity solutions for dilution cryostats. It is also advancing AME applications for defense, aerospace, missile, space, and other mission-critical environments, while continuing to monetize parts of its medical technology portfolio.